한국표면공학회지 (Journal of the Korean institute of surface engineering)
- 제33권5호
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- Pages.373-380
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- 2000
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
리플로우과정의 용융 거동에 미치는 전기주석 도금층의 결정 형상 및 구조의 영향
Effects of morphology and structure of electrolytic tin coating layers on the flow melting behaviors during reflow treatment
초록
The flow melting behavior of the electrolytic tinplate during reflow treatment was investigated in terms of morphology and structure of coating layers which were electrodeposited with variation of electrolyte temperature. It was commonly found that the nucleation density of the electrodeposits showed little difference with the electrolyte temperature, and the growth of electrodeposited tin occurred along <100> direction of (002) plane. At low electrolyte temperature, the (002) plane of tin nucleated paralleling to the substrate and grew perpendicularly to the substrate, which rendered porous rod-like deposits. With increasing the temperature, the (002) plane nucleated declining
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