Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 7 Issue 3
- /
- Pages.37-44
- /
- 2000
- /
- 1226-9360(pISSN)
- /
- 2287-7525(eISSN)
Impedance Change of Aluminum Pad Coated with Epoxy Molding Compound for Semiconductor Encapsulant
반도체 패키지 봉지재용 에폭시 수지 조성물이 코팅된 알루미늄 패드의 임피던스 변화
Abstract
The corrosion behavior of aluminum pad coated with epoxy molding compound (EMC) was investigated using electrochemical impedance spectroscopy (EIS). The impedance change was evaluated by the absorption of deionized water (DI water) to EMC coating and the interface between EMC and aluminum. During the absorption a decrease in resistance and thus an increase in capacitance of EMC as well as the interface of EMC/Al could be observed. Up to about 170 hours of absorption the EMC was saturated with the water molecules and ions generated from EMC. Subsequently the ionic water was penetrated to the interface and finally the corrosion of aluminum was occurred by the Dl water and ions. From measuring the adhesion strength with the Dl water absorption it was expected that the saturation of water and ions in the interface decreased the adhesion strength. The higher filler content of EMC should be necessary to inhibit the corrosion of aluminum electrode in microelectronic packages.
Electrochemical impedance spectroscopy (EIS)를 이용하여 에폭시 수지 조성물이 코팅된 알루미늄 패드의 부식거동을 연구하였다. 에폭시 수지 조성물은 반도체 패키지 봉지용으로써 80 wt%의 충전재를 포함하고 있으며,
Keywords
- Corrosion;
- Epoxy molding compound;
- Aluminum pad;
- Electrochemical impedance;
- Microelectronic packages