한국통신학회논문지 (The Journal of Korean Institute of Communications and Information Sciences)

  • 제25권3A호
  • /
  • Pages.424-429
  • /
  • 2000
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  • 1226-4717(pISSN)
  • /
  • 2287-3880(eISSN)
한국통신학회 (The Korean Institute of Commucations and Information Sciences)
권호 표지

다층구조에서 도체 두께를 고려한 비대칭 결합선로의 특성해석

Characteristic Analysis of the Asymmetric Coupled microstrip Lines with finite Metalization Thickness in the Multilayered Structure

  • 윤남일 (연세대학교 전기·컴퓨터공학과 전파통신연구실) ;
  • 홍익표 (연세대학교 전기·컴퓨터공학과 전파통신연구실) ;
  • 박한규 (연세대학 교 전기·컴퓨터공학과 전파통신연구실)
  • 발행 : 2000.03.01
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초록

본 논문에서는 준정적 해석방법을 사용하여 다층 구조에서 유한한 도체 두께를 갖는 비대칭결합 마이크로스트립(ACM: Asymmetric Couple Microstrip) 선로의 특성을 연구하였다. 준정적 해석방법으로서 모드정합법을 이용하였으며, ACM 선로의 특성 임피던스와 유효 유전율 상수가 도체 두께의 함수로 나타나는 결과를 얻었다. 수치해석 결과를 통해서 단층 및 다층구조에서 도체 두께의 변화로 인하여 ACM 선로의 전파특성이 변화되는 것으로 나타났다.

In this paper, the characteristics of the asymmetric coupled microstrip(ACM) lines with finite metalization thickness are investigated using the quasi-static analysis in the multilayered structure. By mode-matching method as the quasi-static analysis. the characteristic impedances and effective dielectric constants in ACM lines are obtained as a function of metalization thickness. The numerical results show that the propagation characteristics of ACM lines in the single and multilayered structure will be changed by the variation of metalization thickness.

키워드

참고문헌

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