The Journal of Korean Institute of Communications and Information Sciences (한국통신학회논문지)

The Korean Institute of Commucations and Information Sciences (한국통신학회)
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Characteristic Analysis of the Asymmetric Coupled microstrip Lines with finite Metalization Thickness in the Multilayered Structure

다층구조에서 도체 두께를 고려한 비대칭 결합선로의 특성해석

  • 윤남일 (연세대학교 전기·컴퓨터공학과 전파통신연구실) ;
  • 홍익표 (연세대학교 전기·컴퓨터공학과 전파통신연구실) ;
  • 박한규 (연세대학 교 전기·컴퓨터공학과 전파통신연구실)
  • Published : 2000.03.01
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Abstract

In this paper, the characteristics of the asymmetric coupled microstrip(ACM) lines with finite metalization thickness are investigated using the quasi-static analysis in the multilayered structure. By mode-matching method as the quasi-static analysis. the characteristic impedances and effective dielectric constants in ACM lines are obtained as a function of metalization thickness. The numerical results show that the propagation characteristics of ACM lines in the single and multilayered structure will be changed by the variation of metalization thickness.

본 논문에서는 준정적 해석방법을 사용하여 다층 구조에서 유한한 도체 두께를 갖는 비대칭결합 마이크로스트립(ACM: Asymmetric Couple Microstrip) 선로의 특성을 연구하였다. 준정적 해석방법으로서 모드정합법을 이용하였으며, ACM 선로의 특성 임피던스와 유효 유전율 상수가 도체 두께의 함수로 나타나는 결과를 얻었다. 수치해석 결과를 통해서 단층 및 다층구조에서 도체 두께의 변화로 인하여 ACM 선로의 전파특성이 변화되는 것으로 나타났다.

Keywords

References

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