PCB 선로에서 복사되는 불요전자파를 억제하기 위한 기술

The EMI Suppression Technology for Radiated Emissions from PCB Traces

  • 발행 : 2000.10.01

초록

PCB에서의 불요전자파 복사를 줄이기 위하여 많은 방법들이 이용되고 있으나, 본 논문에서는 영상평면을 적용하여 불요 전자파 복사를 줄이는 방법을 제시하였다. PCB에서의 영상평면 효과를 해석하기 위한 모델을 제시하였으며, FEM(Finite Element Method)으로 시뮬레이션을 한 후, 전계 프로브를 사용하여 불요 전자파의 세기를 측정하였다. 그 결과 PCB에서 복사되는 불요전자파의 세기는 영상평면의 폭과 간격에 따라 다르게 나타나며 측정한 결과와 시뮬레이션 결과가 유사한 것을 알 수 있었다. 그러므로 PCB에서 복사되는 불요전자파를 억제하기 위하여 영상평면을 적절히 사용한다면 EMI 저감 대책면에서 효과적이라는 것을 알 수 있었다.

Among many EMI suppression techniques for radiated emissions from PCB traces, image technique is adapted in this paper. A model for the analysis of the effect of image plane on the radiation of a microstrip trace is presented. After a simulation was carried out by using the FEM(Finite Element Method), field strength was measured with electric probe. The radiated emission levels were measured for various image plane width, separation distances, and their results show that the measured data are very close to those of simulation result. It proves that a proper use of image planes on the PCBs is very effective means of reducing EMI emissions on the PCBs.

키워드

참고문헌

  1. IEEE Transaction on Power Apparatus and Systems v.PAS-87 no.3 The Accurate Calculation of Skin Effect in Conductors of Complicated Shape P. Silvestor
  2. IEEE Trans. Electromagnetic Compatibility Skin-Effect Modeling of Radiated Emissions from Backplanes Dheena Moongilian
  3. IEEE Trans. Electromagnetic Compatibility v.38 The effectiveness of an image plane in reducing radiated emissions John T. Fessler;Keith W. Whites;Clayton R. Paul
  4. EMC and the Printed Circuit Board Mark I Montros
  5. IEEE Symposium, Electromagnetic Compatibility Skin-Effect Modeling of Image Plane Techniques for Radiated Emissions from PCB Traces Dheena Moongilan
  6. The Finite Element Method in Electromagnetics Jianming Jin
  7. IEEE Symposium, Electromagnetic Compatibility Radiated Emission from Printed Circuit Board Traces Including the Effect of Vias, as a Function of Source, Termination and Board Characteristics Robert G. Kaires