한국세라믹학회지 (Journal of the Korean Ceramic Society)
- 제37권2호
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- Pages.140-144
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- 2000
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- 1229-7801(pISSN)
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- 2234-0491(eISSN)
저 출력 레이저를 이용한 다이아몬드 후막의 절단
Laser Cutting of Thick Diamond Films Using Low-Power Laser
초록
Laser cutting of thick diamond films is studied using a low-power(10 W) copper vapor laser. Due to the existence of the saturation depth in laser cutting, thick diamond films are not easily cut by low-power lasers. In this study, we have adopted a low thermalconductivity underlayer of alumina and a heating stage (up to 500