The Transactions of the Korean Institute of Electrical Engineers C (대한전기학회논문지:전기물성ㆍ응용부문C)

The Korean Institute of Electrical Engineers (대한전기학회)
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Estimation of Residual Stresses in Micromachined Films

마이크로머시닝 기술에 의해 형성된 막에 있어서의 잔류응력 추정

  • 민영훈 (삼성전자(주), 서울대 공대 전기공학부) ;
  • 김용권 (서울대 공대 전기공학부)
  • Published : 2000.06.01
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Abstract

A new method of measuring residual stress in micromachined film is proposed. An estimation of residual stress is performed by using least squares fit with an appropriate deflection modeling. an exact value of residual stress is obtained without any of the ambiguities that exist in conventional buckling method, and a good approximation is also obtained by using a few data points. Therefore, the test structures area could be greatly decreased by using this method. The measurement can be done more easily and simply without any actuation or any specific measuring equipment. The structure and fabrication processes described in this paper are simple and widely used in surface micromachining. In addition, in-situ measurement is available by using the proposed method when the test structure and the measurement structure are fabricated on a wafer simultaneously.

Keywords

References

  1. G.G. Stoney, 'The tension of metallic films deposited by electrolysis,' Proc. Roy. Soc., vol. 9, pp. 172-175, 1909 https://doi.org/10.1098/rspa.1909.0021
  2. M. Mehregany, R. Howe and S. Senturia, 'Novel microstructures for the in situ measurement of the mechanical properties of thin films,' J. Appl. Phys., vol.62, no.9, pp.3579-3584, 1 Nov. 1987 https://doi.org/10.1063/1.339285
  3. P.M. Zavracky, G.G. Adams, and P.D. Aquilino, 'Strain analysis of silicon-on-insulator films produced by zone melting recrystallization,' J. Microelectromechanical Systems, vol. 4, no. 1, pp. 42-48, Mar. 1995 https://doi.org/10.1109/84.365369
  4. Y. Gianchandani and K. Najafi, 'Bent-Beam Strain Sensors,' J. Microelectromechanical Systems, vol. 5, no. 1, pp. 52-58, Mar. 1996 https://doi.org/10.1109/84.485216
  5. J.F.L. Goosen, B.P. van Drieenhuizen, P.J. French and R.F. Wolffenbuttel, 'Stress measurement structures for micromachined sensors,' Tech. Dig. 7th Int. Conf. On Solid State Sensors and Actuators, Transducers 93(Yokohama, Japan), pp.783-786, 1993
  6. F. Ericson, S. Greek, J. Soderkvist and J.A. Schweitz, 'High-sensitivity surface micromachined structures for internal stress and stress gradient evaluation,' J. Micromech. Microeng., vol. 7, pp.30-36, 1997 https://doi.org/10.1088/0960-1317/7/1/006
  7. H. Guckel, T. Randazzo and D.W. Burns, 'A simple technique for the determination of mechanical strain in thin films with applications to polysilicon,' J. Appl. Phys., vol.57, no.5, pp.1671-1675, Mar. 1, 1985 https://doi.org/10.1063/1.334435
  8. H. Guckel, D. Burns, C. Rutigliano, E. Lovell and B. Choi, 'Diagnostic microstructures for the measurement of intrinsic strain in thin films,' J. Micromech. Microeng., vol. 2, pp. 86-95, 1992 https://doi.org/10.1088/0960-1317/2/2/004
  9. O. Tabata, K. Kawahata, S. Sugiyama, and I. Igarashi, 'Mechanical property measurements of thin film using load-deflection of composite rectangular membrane,' Proc. IEEE Microelectromechanical Systems, pp. 152-156, 1989
  10. D. Maier-Schneider, J. Maibach, E. Obermeier and D. Schneider, 'Variations in Youngs Modulus and Intrinsic stress of LPCVD-polysilicon due to high-temperature annealing,' J. Micromech. Microeng., vol.5, pp. 121-124, 1995 https://doi.org/10.1088/0960-1317/5/2/016
  11. L.M. Zhang, D. Uttamchandani, and B. Clushaw, 'Measurement of the mechanical properties of silicon microresonators,' Sensors and Actuators A, 29, pp.79-84, 1991 https://doi.org/10.1016/0924-4247(91)80034-M
  12. Y. Gianchandani and K. Najafi, 'A bulk silicon dissolved wafer process for Microelectromechanical devices,' J. Microelectromechanical Systems, vol.1, no.2, pp.77-85, June 1992 https://doi.org/10.1109/84.157361
  13. X. Y. Ye, Z. Y. Zhou, Y. Yang, J. H. Zhang and J. Yao, 'Determination of the mechanical properties of microstructures,' Solid State Sensors and Actuators(Transducers 95 Eurosensors IX), pp.100-103, 1995 https://doi.org/10.1016/S0924-4247(97)80051-9
  14. K. Najafi and K. Suzuki, 'A novel technique and structure for the measurement of intrinsic stress and Youngs modulus of thin films,' Proc. IEEE Microelectromechanical Systems, pp. 96-97, 1989 https://doi.org/10.1109/MEMSYS.1989.77969
  15. P.M. Osterberg and S.D. Senturia, 'M-TEST: A Test Chip for MEMS Material Property Measurement Using Electrostatically Actuated Test Structures.' J. Microelectromechanical Systems, vol. 6, no. 2, 107-118, 1997 https://doi.org/10.1109/84.585788
  16. R. Legtenberg, A.W. Groeneveld and M. Elwenspoek, 'Comb-drive actuator for large displacements,' J. Micromech. Microeng., vol.6, pp.320-329, 1996 https://doi.org/10.1088/0960-1317/6/3/004