Journal of Welding and Joining

  • 제18권6호
  • /
  • Pages.42-47
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  • 2000
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
권호 표지

무연 Sn-Ag-Bi-Ga계 솔더의 특성에 관한 연구

A Study on the Characteristic of Pb-free Sn-Ag-Bi-Ga Solder Alloys

  • 노보인 (한국항공대학교 대학원 기계설계학과) ;
  • 이보영 (한국항공대학교 기계설계학과)
  • 발행 : 2000.12.01
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초록

The object of this study is to estimate Sn-Ag-Bi-Ga solder alloy as a substitute for Sn-37Pb alloy. For Sn-Ag-Bi-Ga alloys, Ag, Bi and Ga contents are varied. (Ag : 1~5%, Ga : 3%, Bi : 3~6%) Comparing to Sn-37Pb alloy Sn-Ag-Bi-Ga alloys have wider melting temperature range up to max. $18.7^{\circ}C$. With increasing Ag, Bi contents, the wettability of the alloys increased up to max. 6.6 mN. The vickers hardness of the alloys was max. 46.4 Hv. The ultimate tensile stress of the alloys was max. 60.3 MPa and the elongation was max. 1.2%. The joint strength between circuit board and solder was max. 55.5 N and the joint strength between connector and solder was max. 176.1 N. There were no cracks in this alloys after thermal shock test.

키워드

참고문헌

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