플라스틱 BGA 패키지의 신뢰성에 관한 연구

A Study on the Reliability of Plastic BGA Package

  • 발행 : 2000.04.01

초록

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.

키워드

참고문헌

  1. IEPS Conference Popcorning in PBGA Package during IR reflow soldering P.McCluskey;R.Munamarty
  2. IEEE Transaction on components, packaging, and Manufacturing Technology Moisture absorption and desorption, predictions for Plastic Ball Grid Array packages J.E.Galloway;B.M.Miles
  3. IEMT/IMC Proceedings The Reliability of Plastic Ball Grid Array S. Yuko;Y. Akihiko
  4. 大韓溶接學會誌 v.17 no.3 동박과 PSR간의 접착력 향상에 관한 연구 金京燮;辛永議
  5. IEPS Conference The PBGA: A systematic study of moisture resistance G.Hawkin;G.Ganesan
  6. Proceedings of the 2nd Pan Pacific Microelectronics Symposium Reduction of popcorning in BGAs by Plasma Cleaning D.S.Chun;D.A.Doane
  7. Microelectronics Reliability Plasma Cleaning of Plastic Ball Grid Array Package C. Lee;K. Nyunt
  8. IEEE Trans. Comp. Hybrids, Manufact. Technol. Improvement in Wire Bonding and Solder of Surface Mount Components Using Plasma Cleaning Techniques Rust RD;Doane DA