한국정밀공학회지 (Journal of the Korean Society for Precision Engineering)
- 제16권5호통권98호
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- Pages.40-47
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- 1999
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- 1225-9071(pISSN)
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- 2287-8769(eISSN)
화학기계적연마(CMP) 컨디셔닝에 관한 연구
A Study on Novel Conditioning for CMP
- 발행 : 1999.05.01
초록
In CMP for semiconductor wafer films, the acceptable within-chip planarity, within-wafer and wafer-to-wafer nonuniformity could be achieved by conditioning. The role of conditioning is to remove continuously polishing residues from pad and to maintain the initial pad surface pores. To reach these requirements, the diamond grits disk has been considered as a conventional conditioner. However, we have investigated many defects as scratch on wafers out of diamond grits shedding, contaminations from bonding materials, and pad pore subsidences by over-conditioning. So, this paper studies the effect of ultrasonic vibration in CMP conditioning as a representative. The effect of ultrasonic vibration was certified through ILD, Metal CMP.