한국표면공학회지 (Journal of the Korean institute of surface engineering)
- 제32권6호
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- Pages.703-708
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- 1999
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
열증착법으로 제조된 니켈 모노실리사이드의 미세구조 연구
A study of microstructure of Ni-monosilicide fabricated with a thermal evaporator
초록
Silicides have been used extensively in ULSI logic device fabrication as contact materials for the active areas as well as the poly- Si gates. NiSi is a promising candidate for submicron device application due to less volume expansion, low formation temperature, little silicon consumption, and large stable processing temperature window. In this report, the microstructure of nickel silicides fabricated with a thermal evaporator has been investigated. We observed systematic transformation of Ni silicides of
키워드