한국표면공학회지 (Journal of the Korean institute of surface engineering)
- 제32권6호
- /
- Pages.647-657
- /
- 1999
- /
- 1225-8024(pISSN)
- /
- 2288-8403(eISSN)
리드프레임/EMC 계면의 파괴 인성치
Fracture Toughness of Leadframe/EMC Interface
초록
Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I (
키워드