Journal of the Korean institute of surface engineering (한국표면공학회지)
- Volume 32 Issue 4
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- Pages.496-502
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- 1999
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
A study on the adhesion of Ag film deposited on Alloy42 substrate
Alloy42 기판 위에 증착된 Ag막의 밀착력에 관한 연구
Abstract
Electroplating of Ag and Au on the functional area of lead frames are required for good bonding ability in IC packaging. As the patterns of the lead frame become finer, development of new deposition technology has been required for solving problems associated with process control for uniform thickness on selected area. Sputtering was employed to investigate the adhesion between substrate Alloy42 and Ag film as a new candidate process alternative to conventional electroplating. Coating thickness of Ag film was controlled to 3.5
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