Heat transfer enhancement in electronic modules using a turbulence promoter

난류촉진체에 의한 전자칩의 열전달촉진에 관한 연구

An experimental study was carried out to investigate the effects of using various shapes of turbulence promoter on the heat-transfer enhancement of 2-D and 3-D arrays of rectangular modules in a rectangular channel for design of noiseless and low-powered cooling fan in the electronic systems. Measurements of heat/mass transfer coefficients were made using a naphthalene sublimation technique, and the friction factors were measured for Reynolds numbers in the range$3.3{\time}10^3$~$1.6{\time}10^4$. Flow visualization was peformed by oil-film method. It was found that heat transfer and pressure drop increased remarkably due to the existence of the promoter. The results of the performance evaluation based on equal pumping power were showed that substantial heat-transfer enhancement was obtained at low Reynolds number range by use of a turbulence promoter.