마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제6권2호
- /
- Pages.31-36
- /
- 1999
- /
- 1226-9360(pISSN)
- /
- 2287-7525(eISSN)
효율적 수치해석기법을 이용한 반도체 페키지의 열방출 해석
Efficient Approach to Thermal Modeling for IC Packages
- Seung Mo Kim (R&D Center, Anam Semiconductor, Inc.) ;
- Choon Heung Lee (R&D Center, Anam Semiconductor, Inc.)
- 발행 : 1999.06.01
초록
An efficient method for thermal modeling of QFP is Proposed. Thermal measurement data are given to verify the method. In parallel with the experiment, an exact full 3-D model calculation is also provided. One fonds that there is an excellent agreement between validation data and the efficient model data.
키워드