마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제6권2호
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- Pages.13-21
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- 1999
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
FLIP CHIP ON ORGANIC BOARD TECHNOLOGY USING MODIFIED ANISOTROPIC CONDUCTIVE FILMS AND ELECTROLESS NICKEL/GOLD BUMP
- Yim, Myung-Jin (Department of Materials Science and Engineering, KAIST) ;
- Jeon, Young-Doo (Department of Materials Science and Engineering, KAIST) ;
- Paik, Kyung-Wook (Department of Materials Science and Engineering, KAIST)
- 발행 : 1999.06.01
초록
Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with
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