참고문헌
- J. Am. Ceram. Soc. v.74 no.5 Ceramic and Glass-Ceramic Packaging in the 1990s R. R. Tummala
- ISHM 91 Proceedings Low Temperature Co-fired Ceramic:An Emerging Technology in Europe M. Massiot
- ISHM 92 Proceedings Application of Low Temperature Fired Multilayered Substrates to High Frequency M. Kato;S. Nishigaki
- IMC 1996 Proceeding Advanced Ceramic Multilayer functional Paekages for Telecommunications Equipment H. Mandai;N.Nakajima and K. Tongegawa
- ISHM 94 Proceedings Structure-Property Relationships in Low-Temperature Cofired Ceramic A.A.Shapiro;D.F.Elwell
- ISHM 94 Proceedings Multifunctional Ceramic Substrates and Packages for Telecommunication Applications C. Makihara;K. Ikeda;H. Wada;Y. Sawa;S. Tanahashi
- IMC 94 Proceedings Study of the Strain Mechanism of Multilayer Ceramic Substrate M.Totokawa;J. Ishikawa;A. Kobayashi
- ISHM 92 Proceedings Real Time Sintering Observations of LTCC Substrate and Conductor Materials W. S. Hackenberger;T.R. Shrout;J P. Dougherty;R.F. Speyer
- ISHM 93 Proceedings Sintering Phenomena and Microstructural Development in LTCC Multilayer Substrates W.S. Hackenberger;T.R. Shrout;J.P. Dougherty