정전형 미소 평판 공진자의 설계 및 제작

Design and Fabrication of an Electrostatic Microplate Resonator

  • 발행 : 1999.06.01

초록

This paper represents an electrostatic micro plate resonator which consists of a rigid plate suspended with four bridges and a counter electrode. The bridges of the resonator are designed corrugated so that the residual stress are released. The FEM simulation results confirmed that the deflection characteristic of the corrugated bridge is hardly affected by the initial residual tensile stress. One resonator with the corrugated bridges and the other with the flat bridges were fabricated by the boron diffusion process and the anisotropic etch process. The vertical deflection of the fabricated electrostatic resonator was measured with a laser vibrometer, and the data were compared with the calculation results. The deflection of the resonator with the flat bridges is smaller than the deflection of that with the corrugated ones because of the residual stress. The residual stress release effect was confirmed by the fact that the measured deflection of the resonator with the corrugated bridges in close to the calculated deflection of the resonator with the flat ones with the initial stress neglected.

키워드

참고문헌

  1. Appl. Phys. Lett. v.67 no.7 A Technique for Quantitative Determination of the Profile of the Residual Stress along the Depth of $p^8$ Silicon Films E. H. Yang;S. S. Yang;S. H. Yoo
  2. KSME International Journal v.12 no.2 Fabrication and Electrostatic Actuation of Thin Diaphragms E. H. Yang;S. S. Yang;O. C. Jeong
  3. IEEE/ASME Journal of MEMS The Design, Fabrication, and Testing of Corrugated Silicon Nitride Diaphragms P. R. Scheeper;W. Olthuis;P. Bergveld
  4. ASME Winter Meeting v.DSC-59 Dynamic Characteristic of Corrugated and Flat $p^+$ Diaphragms Actuated Electrostatically under Residual Stress E. H. Yang;S. S. Yang;E. J. Park;S. H. Yoo
  5. Formulas for stress, strain, and structural Matrices D. P. Walter
  6. Proc., IEEE Transducers '89 v.2 Residual Stress and Mechanical Properties of Boron doped $p^+$ Silicon Films Ding, X.;Ko, W. H;Mansour, J. M.
  7. J. Micromech. Microeng v.7 Improved Analysis of Microbeams under Mechanical and Electrostatic Loads B. K. Choi;E. G. Lovell
  8. Eurosensors X Writing FIB Implantation and Subsequent Anisotropic Wet chemical Etaching for Fabrication of 3D Structures in Silicon B. Schmidt;L. Bischoff;J. Teichert