A study on the Fabrication and Characterization of Alumina Electrostatic Chuck for Silicon Wafer Processing

실리콘웨이퍼 공정용 알루미나 정전척의 제작과 특성에 관한 연구

  • 정광진 (울산대학교 재료금속공학부) ;
  • 박용균 (울산대학교 재료금속공학부) ;
  • 이영섭 (울산대학교 재료금속공학부) ;
  • 조동율 (울산대학교 재료금속공학부) ;
  • 천희곤 (울산대학교 재료금속공학부)
  • Published : 1999.11.30

Abstract

Alumina electrostatic chucks for silicon wafer process with wide range of electrical resistivity were fabricated by controlling the amount of $TiO_2$ addition(0, 1.3, 2.0, 2.8 wt%). The dependence of electrostatic force on applied voltage, temperature and humidity was investigated. In addition, response characteristics on applied voltage and relationship between electrical resistivity and electrostatic force characteristics such as Coulomb force and Johnsen-Rahbeck force were discussed.

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