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Thermal Performance of a Heating Board with a Microencapsulated Myristic Acid

Myristic acid를 사용한 축열장판의 열성능 연구

  • Kwak, H.Y. (Korra Institute of Energy Research) ;
  • Kang, Y.H. (Korra Institute of Energy Research) ;
  • Jeon, M.S. (Korra Institute of Energy Research) ;
  • Lee, T.K. (Korra Institute of Energy Research) ;
  • Lee, D.G. (Department of Nuclear & Energy Engineering, Cheju National University) ;
  • Han, G.Y. (Department of Chemical Engineering, SungkyunKwan University)
  • Published : 1998.09.30
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Abstract

The thermal performance of a heating board with microencapsualted PCM was investigated and compared to conventional heating board. The employed PCM was the myristic acid $$ and was encapsulated by the multiple layers of PMMA and paraffin wax. The size of encapsulated PCM was $1{\sim}1.5mm$. Accoring to ANSI/ASHRAE test procedure, the close-loop test configuration was installed. Air was used as the heat transfer fluid and a calibrated orifice was employed for the measurement of air flow rates. The thermal performance test of two different heating boards(with 10 wt% PCM and without PCM) was conducted for different air flow rates and the heat transfer characteristics during cooling was compared. The test results showed that the surface temperature of heating board with 10 wt% PCM maintained higher during the cooling process than that of the heating board without PCM and experimentally determined heat transfer coefficient in heating board with PCM showed higher value compared to heating board without PCM.

본 논문은 미세캡슐을 함유한 축열장판의 열성능에 관해서 조사하였고 기존 시판되고 있는 장판과 비교를 하였다. 상변화물질로는 Myristic Acid($CH_3(CH_2)_{12}COOH$)를 사용했고 이 물질을 PMMA와 왁스로 3중 코팅을 하였고 $1{\sim}1.5mm$인 캡슐로 제조를 하였다. ANSI/ASHRAE를 토대로 하여 열전달 매체로 공기를 사용한 밀폐형 실험장치를 구성하였으며, 공기유량은 오리피스를 통해서 측정된다. 실험에 사용된 두 개의 서로다른 장판(미세캡슐 함유율 중량비 10% 장판, 0% 장판)의 열성능을 평가하기 위해서 서로다른 공기유량에 대해서 방열시 열전달 특성에 관한 실험을 수행하였다. 실험결과를 보면 방열과정시 미세캡슐 함유율이 10%인 장판의 표면온도는 미세캡슐을 함유하지 않은 장판보다 더 높은 온도를 유지했다. 그리고 장판표면에서의 열전달계수는 미세캡슐을 함유하지 않은 장판과 비교해 볼 때 미세캡슐을 함유한 장판에서 더 높게 나타났다.

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