마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제5권1호
- /
- Pages.7-18
- /
- 1998
- /
- 1226-9360(pISSN)
- /
- 2287-7525(eISSN)
A Study on the Eutectic Pb/Sn Solder Filip Chip Bump and Its Under Bump metallurgy(UBM)
- Paik, Kyung-Wook (Dept. of Materials Science and Engineering Korea Advanced Institute of Science and Technology shary)
- 발행 : 1998.06.01
초록
In the flip chip interconnection on organic substrates using eutectic Pb/Sn solder bumps highly reliable Under Bump Metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems such as 1
키워드