플라스틱 패키지되는 MMIC를 위한 저가격 고품질의 수직형 본딩와이어 인덕터

Low cost high-Q veritcal inductor using bondwires for plastic-packaged MMICs

We proposed a novel bondwire inductor buried in plastic package for low cost MMIC and characaterized the electrical perofmrance in a wide frequency range using the full-wave analysis of finite element method(FEM), and then we fabricated and measured the scale-up model in order to prove the characteristics. Th ebondwire inductor has higher quality factor and higher cutoff frequency than the conventional spiral inductor designed n the same area as the bondwire inductor. Since the air-bridge process is not requried for the bondwire inductor, it is very suitable for low cost plastic-packaged MMIC production. The bondwire inductor has the field distribution localized around the bondwire inductor and hence is more compatible to the crosstalk problems.