ETRI Journal

Electronics and Telecommunications Research Institute (한국전자통신연구원)
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Transient Characteristics of a Two-Phase Thermosyphon Loop for Multichip Module

  • Published : 1998.09.30
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Abstract

A new thermosyphon cooling module (TSCM) has designed, fabricated and tested to cool the multi-chip module consists of a cold plate and an integrated condenser. With an allowable temperature rise of $56^{\circ}C$ on the surface of the heater, the cooling module TSCM can handle a heat flux of about 2.7 $W/cm^2$ using R11 as working fluid. The transient characteristics of the cooling module have been proved to be excellent: that is, when a heat load is applied inside of the system, steady state can be achieved within 10 to 15 minutes. It has been found that the length of the vapor channel between the cold plate and the condenser in addition to the ambient and the condenser temperatures affect the system performance.

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References

  1. 9th Int. Display Research Conf. Broad-band ISDN/Developing Visual Communication for the Future Gotoh, K.
  2. NTT Review v.1 Innovation in Telecommunication towards the 21st Century Toda, I.
  3. J. Heat Transfer v.107 Thermosyphon Boiling in Vertical Channels Bar-Cohen, A.;Schweitzer, H.
  4. Advances in Electronic Packaging(ASME) v.I Two-phase Thermosyphon Cooling for Telecom-Multichip Modules Kishimoto, T.;Harada, A.
  5. Analysis of the Heat Transfer Performance of Offset Strip Fin Geometries in a Cold Plate Operating in a Two-Phase Thermosyphon, Cooling Technology for Electronic Equipment Carcy, V.P.;Mandrusiak, G.D.;Roddy, T.
  6. Proceedings of 10th International Heat Pipe Conference Small Scale Two-Phase Loop Thermosyphons for Cooling Telecommunication Pioro, I.
  7. Proceeding of 10th International Heat Pipe Conference Thermal Control of Electronic Components by Heat Pipes and Thermosyphons Polasek, F.;Zelko, M.
  8. 40th ECTC Multichip 1.8 Gb/s High Speed Space-Division Switching Module Using Copper Polymide Multilayer Substrate Yamanaka, N.;Kituchi, S.;Kon, T.;Ohsaki, T.
  9. Proceeding of Second KSME-JSME Fluids Engineering Conference v.2 An Experiment on Thermosyphon Boiling in Uniformly Heated Vertical Tube and Channel Na, J.;Jeon, J.;Kwak, H.
  10. ASHRAE Trans. v.83 Thermosyphon Loop Performance Characteristics: Part 1. Experimental Study McDonald, T.W.;Hwang, K.S.;DiCiccio, R.
  11. AICHE J. v.26 Forced Convective Boiling in Vertical Tubes for Saturated Pure Components and Binary Mixtures Bennett, D.L.;Chen, J.C.
  12. J. Heat Transfer Japanese Res. v.8 Heat Transfer in Two-Phase Closed-Type Thermosyphons Imura, H.;Kusuda, H.;Ogata, J.
  13. Fundamentals of Heat and Mass Transfer Incropera, F.P.;Dewitt, D.P.
  14. Proceedings of the KSME 1997 Fall Annual Meeting. B Cold Plate Design in Thermosyphon Device for MCM Cooling Kwon, Y.;Na, M.;Nam, S.;Kwak, H.
  15. Int. J. Heat & Fluid Flow v.4 Analysis of Forced-Convection Boiling Flow Instabilities in a Single-Channel Upflow System Dogau, T.;Kakac, S.;Veziroglu, T.N.