과제정보
연구 과제 주관 기관 : 과학재단
참고문헌
- Microelectronics Packaging Handbook Tummala, Rao R.
- Plastic Packaging of Microelectronic Devices Louis T. Manzione
- Polymer Materials for Electronics Packaging and Interconnection J. H. Lupinski
- Polymer for Microelectronics. ASC Symposium Series 537 L. F. Thompson
- Cure Kinetics of Epoxy Cresol ; Novolac Encapsulation for MEP. Contemporary Topic in Polymer Science Rolf.W. Biernath;David S. Soane
- Polym. Eng. Sci. v.18 Optimization of Processing Condition for Thermosetting Polymers by Determination of The Degree of Curing With a Differential Scanning Calorimeter T. A. A. M. Maas
- Electronic materials handbook v.1 Merrill L. Minges
- Polym. Eng. Sci. v.36 Chemorheology of Thermosets-An Overview PETER J HALLEY & MICHAEL E. MACKAY
- Polym. Eng. Sci. v.30 Thermomechanical Properties of IC Molding Compounds, AT&T Bell Laboratories Murray Hill H. E. Bair;D. J. Boyle;J. T. Ryan