Journal of the Korean Vacuum Society (한국진공학회지)
- Volume 6 Issue S1
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- Pages.122-126
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- 1997
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- 1225-8822(pISSN)
ENHANCED ADHESION STRENGTH OF Cu/polyimide AND Cu/Al/polyimide BY ION BEAM MIXING
- Chang, G.S. (Department of Physics, ASSRC, Yonsei University) ;
- Kim, T.G. (Department of Physics, ASSRC, Yonsei University) ;
- Chae, K.H. (Department of Physics, ASSRC, Yonsei University) ;
- Whang, C.N. (Department of Physics, ASSRC, Yonsei University) ;
- Zatsepin, D.S. (Institute of Metal Physics, Russian Academy of Science) ;
- Kurmaev, E.Z. (Institute of Metal Physics, Russian Academy of Science) ;
- Choe, H.S.Lee, Y.P. (Department of Physics Education, Kyungsang UniversityDepartment of Physics, Sunmoon University)
- Published : 1997.10.01
Abstract
the Cu/polyimide system is known to be the best candidate for a multilevel interconnection system due to the low resistance of Cu and to the low dielectric constant of polyimide respectively. Ion beam mixing of Cu(40nm)/polyimide was carried out at room temperature with 80 keV Ar+ and N2+ form
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