Journal of Korean Vacuum Science & Technology
- 제1권1호
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- Pages.30-37
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- 1997
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- 1226-6167(pISSN)
Diffusion barrier characteristics of molybdenum nitride films for ultra-large-scale-integrated Cu metallization(II); Effect of deposition conditions on diffusion barrier behavior of molybdenum nitride
- Lee, Jeong-Joub (Department of Metallurgical Engineering, Hanyang University) ;
- Lee, You-Kee (Department of Metallurgical Engineering, Hanyang University) ;
- Jeon, Seok-Ryong (Department of Metallurgical Engineering, Hanyang University) ;
- Kim, dong-Joon (Department of Metallurgical Engineering, Hanyang University)
- 발행 : 1997.06.01
초록
Interactions of Cu films with Si substrates separated by thin layers of molybdenum and molybdenum nitride were investigated in the viewpoint of diffusion barrier to copper. the diffusion barrier behavior of the layers was studied as functions of deposition and annealing conditions by cross-sectional transmission electron microscopy and Nomarski microscopy. the layers deposited at
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