Journal of Korean Vacuum Science & Technology
- Volume 1 Issue 1
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- Pages.24-29
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- 1997
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- 1226-6167(pISSN)
Diffusion barrier characteristics of molybdenum nitride films for ultra-large-scale-integrated Cu metallization (I); Surface morphologies and characteristics of sputtered molybdenum nitride films
- Jeon, Seok-Ryong (Department of Metallurgical Engineering, Hanyang University) ;
- Lee, You-Kee (Department of Metallurgical Engineering, Hanyang University) ;
- Park, Jong-Wan (Department of Metallurgical Engineering, Hanyang University)
- Published : 1997.06.01
Abstract
Surface morphologies and fundamental characteristics of molybdenum nitride films deposited by reactive dc magnetron sputtering were studied for application to Cu diffusion barrier. A phase transformation from Mo to
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