The Korean Journal of Ceramics

The Korean Ceramic Society (한국세라믹학회)
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Estimation of Interfacial Adhesion through the Micromechanical Analysis of Failure Mechanisms in DLC Film

  • Jeong, Jeung-Hyun (Division of Materials Science and Engineering, Seoul National University) ;
  • Park, Hae-Seok (Division of materials Science and Engineering, Seoul National University) ;
  • Ahn, Jeong-Hoon (Division of Materials Science and Engineering, Seoul National University) ;
  • Dongil Kwon (Division of Materials Science and Engineering Seoul National University)
  • Published : 1997.06.01
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Abstract

In this paper, it is intended to present more reproducible and quantitative method for adhesion assemssement. In scratch test, micromechanical analysis on the stress state beneath the indenter was carried out considering the additional blister field. The interface adhesion was quantified as work of adhesion through Griffith energy approach on the basis of the analyzed stress state. The work of adhesion for DLC film/WC-Co substrate calculated through the proposed analysis shows the identical value regardless of distinctly different critical loads measured with the change of film thickness and scratching speed. On the other hand, uniaxial loading was imposed on DCL film/Al substrate, developing the transverse film cracks perpendicular to loading direction. Since this film cracking behavior depends on the relative magnitude of adhesion strength to film fracture strength, the quantification of adhesion strength was given a trial through the micromechanical analysis of adhesion-dependence of film cracking patterns. The interface shear strength can be quantified from the measurement of strain $\varepsilon$s and crack spacing $\lambda$ at the cessation of film cracking.

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References

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