레이저변수(變數)와 피삭재조건(被削材條件)이 목재(木材) 및 목질(木質)보드의 절삭특성(切削特性)에 미치는 영향(影響)(I) - 절삭(切削)깊이와 절삭폭(切削幅) -

Effects of Laser Parameters and Workpiece Conditions on Cutting Characteristics of Solid Wood and Wood-based Panel(I) - Cutting Depths and Kerf Widths -

Laser cutting tests were conducted to investigate the laser cutting characteristics of solid woods such as 25mm-thick white oak(Quercus acutissima) and maple(Acer mono), and wood-based panels such as 15mm-thick medium density fiberboard and particleboard. Test variables were laser power, cutting speed, grain direction, and moisture content. Cutting depths, kerf widths and the maximum cutting speed were measured. Cutting depths were increased as focus of laser beam was moving from above the workpiece to on the surface of workpiece, and also to below the workpiece. Kerf widths were decreased as focus of laser beam was moving from above the workpiece to on the surface of workpiece, but were increased as focus of laser beam was moving from on the surface of workpiece to below the workpiece. Minimum kerf widths were obtained when focus of laser beam was positioned on the surface of workpiece. Cutting depths and kerf widths were decreased with increase in moisture content, and cutting depths and kerf widths of more dense white oak were smaller than those of maple. And also cutting depths and kerf widths of particleboard were smaller than those of medium density fiberboard.