한국정밀공학회지 (Journal of the Korean Society for Precision Engineering)
- 제13권6호
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- Pages.45-51
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- 1996
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- 1225-9071(pISSN)
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- 2287-8769(eISSN)
초미립 숫돌에 의한 경면연삭
Mirror Surface Grinding Using Ultrafine Grit Wheel
초록
Silicon wafers are required to be finished under the roughness of nanometer order for the subsequent chip fabrication processes. Recently, the finish grinding techniques have been researched for the improvement of accuracy and surface roughness simultaneously. Among them, the grinding technique using fine abrasive has been known as an easily accessible method. However, the manufacture of the fine grit grinding wheel has been very difficult because of the coherence of the grits. In this paper, the development of the ultrafine grit silica(