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Synthesis of Surface Active Properties of Destructible Surfactants with 1,3-Dioxane

1,3-디옥산을 함유한 분해성 계면활성제의 합성의 및 계면 특성

  • Kim, Chi-Hoi (Dept. of Indu. Chem. Chungbuk Nat. Univ.) ;
  • Roh, Yun-Chan (Dept. of Chem. Yonsei Univ., Rese. Insti.) ;
  • Kim, Yu-Ok (Dept. of Chem. Engi., Dongyang Industrial College) ;
  • Nam, Kie-Dae (Dept. of Indu. Chem. Chungbuk Nat. Univ.)
  • 김치회 (충북대학교 공과대학 공업화학과) ;
  • 노윤찬 (연세대학교 산업기술연구소 화학공학부) ;
  • 김유옥 (동양공업전문대학 화학공학부) ;
  • 남기대 (충북대학교 공과대학 공업화학과)
  • Published : 1996.11.30

Abstract

In acid-catalyzed acetal cyclization of long aliphatic aldehydes($R=n-C_7H_{15}$ ; $n-C_9H_{19}$ ; $n-C_{11}H_{23}$) with 1,1,1-tris(hydroxymethyl)propane, 2-alkyl-5-hydroxymethyl-5-ethyl-1,3-dioxanes were obtained. The final products, sodium 2-alkyl-5-(sulfonatedpropylethermethyl)-5-ethyl-1,3-propanesultion in the presence of sodium hydride. These compounds were a new group of destructible surfactants which were readily hydrolyzed and oxidized in natural water reservoirs. Physical properties of these new compounds involved some surface properties such as Krafft point(Kp), critical micelle concentration(cmc), surface tension of aqueous solutions near cmc(${\gamma}_{min}$), foaming power, emulsion power and hydrolysis properties were determined. The destructible surfactants containing 1,3-dioxane ring were synthesized to about $85{\pm}5.5%$ yield. The cmc values of the compounds by ring method were assumed to $0.5{\sim}5.0{\times}10^{-3}mol/L$ range and surface tensions at cmc were $29.5{\sim}33.0dyne/cm$ respectively at $25^{\circ}C$. The foaming power and foam stability were $170{\sim}230mm$ and $52{\sim}135mm$ respectively at $1{\times}10^{-2}mol/L$, foam was occurred rarely below $1{\times}10^{-3}mol/L$. The emulsion property of liquid paraffin was better than that of soybean oil. For hydrolysis property with ph and time, these compounds were decomposed within about 200minutes at $ph1{\sim}2$. Hopefully these compounds are expected to be a good O/W emulsifier that have decomposability in acid and may be used in the process which do not need foaming.

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