한국표면공학회지 (Journal of the Korean institute of surface engineering)
- 제29권6호
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- Pages.709-713
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- 1996
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
PREPARATION OF ANISOTROPIC CONDUCTIVE FINE PARTICLES BY ELECTROLESS NICKEL PLATING.
- Fujinami, T. (Faculty of Engineering Kanto Gakuin University) ;
- Watanabe, J. (Faculty of Engineering Kanto Gakuin University) ;
- Motizuki, I. (Faculty of Engineering Kanto Gakuin University) ;
- Honma, H. (Faculty of Engineering Kanto Gakuin University)
- 발행 : 1996.12.01
초록
Mechanical solderless chip packaging with small gold bumps or metal balls has increased in the electronic devices. The preparation of conductive particles (5~7
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