한국표면공학회지 (Journal of the Korean institute of surface engineering)
- 제29권5호
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- Pages.379-385
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- 1996
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
THIN FILM ADHESION IN Cu/Cr/POLYIMIDE AND Cu/Cu-Cr/POLYIMIDE SYSTEMS
- Joh, Cheol-Ho (Dept. of Materials Engineering, Hanyang University) ;
-
Kim, Young-Ho
(Dept. of Materials Engineering, Hanyang University) ;
- Oh, Tae-Sung (Dept. of Metall. and Mater. Sci., Hongik University) ;
- Park, Ik-Sung (Dept. of Mater. Sci. and Eng., KAIST) ;
- Yu, Jin (Dept. of Mater. Sci. and Eng., KAIST)
- 발행 : 1996.10.01
초록
Adhesion of Cu/Cr and Cu/
키워드