ICBD 법에 의한 $ Y_2O_3$박막특성에 관한 연구

Properties of $ Y_2O_3$ Thin Films Prepared by ICBD Method

  • 전정식 (삼성전자(주) 반도체 연구소) ;
  • 문종 (삼성전자(주) 반도체 연구소) ;
  • 이상인 (삼성전자(주) 반도체 연구소) ;
  • 심태언 (삼성전자(주) 반도체 연구소) ;
  • 황정남 (연세대학교 물리학과)
  • Jeon, J. S. (Semiconductor R &D Center, Samsung Electronics Co., Ltd) ;
  • Moon, J. (Semiconductor R &D Center, Samsung Electronics Co., Ltd) ;
  • Lee, S. I. (Semiconductor R &D Center, Samsung Electronics Co., Ltd) ;
  • Shim, T. E. (Semiconductor R &D Center, Samsung Electronics Co., Ltd) ;
  • Hwang, J. N. (Department of Physics, Yonsei University)
  • 발행 : 1996.09.01

초록

$Y_2O_3$ thin film on si(100) was successfully grown by ionized cluster beam(ICBD) technique at substrate temperature of around $500^{\circ}C$ and pressure of ~$10^{-5}$Torr.To prevent the oxidation of Si substrae, a very thin yttrium layer was deposited on Si before reactive depositing of oxygen and yttrium source. In asdeposited stage, b.c.c and h.c.p strucutres of $Y_2O_3$ were observed from S-ary analysis. From the observation of spots and ring patterns in selected area diffractin(SAD) patterns. crystallane formation and growth could be proceeded during the deposition. $Y_2O_3$/mixed layer/$SiO_2=170\AA/50\AA/10\AA$ structure were verified by high resolution transmition electron imcroscopy(HRTEM) image, and the formation of amorphous layer of SiO2 was discussed . Electricla charateristics of the film were also investigated . In as-deposited Pt/$Y_2O_3$/Si sturcuture, leakage current was less than $10^{-6}$A/$\textrm{cm}^2$ at 7MV/cm strength.

키워드

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