The Growth of Fatigue Cracks in Eutectic Solders

  • Lee, Seong-Min (PKG Development, Memory Division, Samsung Electronics Co.)
  • Published : 1996.06.01

Abstract

The grain size effect on grain boyndary cracking in Pb-Sn eutectic during isothermal fatigue was investigated. Fatigue experiments were confined to two conditions : (1) 0.4% total strain range(approximetely 0.2% plastic strain range), 1.67$\times$10$^{-3}$/s frequency; and (2) 1.5% total strain rante(approximately 1.2% plastic strain range), 8.33$\times$10$^{-4}$/s frequency. Fatigue specimens were cross-sectioned to monitor the depth of crack growth continuosly and then, the maximum crack depths in units of the number of boundaries were plotted as functions of number of cycles for these two different strain ranges. The results revealed that the rate of crack growth(per cycle at fixed rate of crosshead motion) can be expressed as dc/dN=($\Delta$$\varepsilon$$_p$)$^n$c where n is typically 2, c is the crack length, $\Delta$$\varepsilon$$_p$ is the plastic strain range, and A is a "constant" that depends on whether the crack is deeper or shallower than its first triple point of the grain boundary, A decrdases by about a factor of three after the crack hits the first triple point, indecating that the fatigue crack is trapped at the triple point of the grain boundaries.

Keywords

References

  1. TMS Thermomechanical Fracture in Solder Materials, Solder Mechanics D.R. Frear;W.B. Jones,;K.R. Kinsman
  2. IEEE. Comp. Hybrids Manufact.Tech P.M. Hall
  3. Low Cycle Fatigue v.342 H.D. Solomon
  4. Welding Research Supp v.51 Fatigue Properties of Solder Joints R.N. Wild
  5. Pro 11th Naval Weapons Electronics Manufacturing Semi-nar, China Lake,CA Today and Yomorrow in Soldering R. Yeanawine;M. Wolverton;A. Burkett;B. Waller;B. Russel;D. Spritz
  6. IPC Technical Reviews v.31 no.3 Grain Boundaries and the Thermal Fatigue of Surface Mount Solder Joints D.S. Stone; S.-M. Lee
  7. IEEE Trans. Components, Hybrids, and Manufacturing Technology v.14 no.3 Grain Boundary Sliding and the Creep-Fatigue Interaction in Solders S.-M. Lee;D.S. Stone
  8. Trans. ASME, Journal of Electronic Packaging v.114 Deformation and Fracture of Pb-Sn Eutectic Under Tensile and Fracture Loading S.-M. Lee; D.S. Stone
  9. Scripta Metallurgica et Materialia v.30 no.9 Grain Boundary Sliding in Pb-Sn Eutectic S.-M. Lee;D.S. Stone
  10. Proc. Symp. Low Cycle Fatigue Strength and Elastic-Plastic Behavior of Materials L. F. Coffin
  11. PhD thesis, Unversity of Wisconsin-Madison S.-M. Lee
  12. The Trend in Engineering v.13 P.C. Paris;M.P. Gomez;W.E. Anderson
  13. Trans. AIME v.233 R.C. Boetterner
  14. PhD thesis, Cornell University Wilcox J.R.