Journal of the Korean Ceramic Society (한국세라믹학회지)

The Korean Ceramic Society (한국세라믹학회)
권호 표지

Shrinkage Control with Variation of Lamination Condition in Multilayer Ceramics

다층세라믹스 제조시 적층 공정 변수에 따른 수축율 조절

  • 성재석 (연세대학교 세라믹공학과) ;
  • 구기덕 (전자부품종합기술연구소) ;
  • 윤종광 (전자부품종합기술연구소)
  • Published : 1996.11.01
Download PDF
⟨ Previous Next ⟩

Abstract

In the fabrication of alumina-based multilayer ceramics sintering shrinkages with lamination conditions such as lamination pressure temperature and laminating with and without press die were compared. The sintering shrinkage was affected substantially by lamination pressure and temperature and in the case of laminatino without press die the lower laminated density and a large difference in shrinkage with direction were observed. These results can be explained by introducing a new factor which is the ratio of the changes of areas before and after lamination.

Keywords

References

  1. Treatise on Materials Science and Technology;Ceramic Fabrication Process v.9 Doctor-Blade Process J.C. Williams;F.F.Y. Wang(ed.)
  2. Ceramic Processing before Firing Tape Casting of Ceramics R.E. Mistler;D.J. Shanefield;R.B. Runk;G.Y. Onoda(ed.);L.L. Hench(ed.)
  3. J. Am. Ceram. Soc. v.77 no.8 Tape Casing of Fine Alumina/Zirconia Powders for Composite Fabrication K.P. Plucknett;C.H. Caceres;D.S. Wilknson
  4. Microelectronics Packaging Handbook R.R. Tummala;E.J. Rymazewski
  5. J. Am. Ceram. Soc. v.74 no.11 Ceramic and Glass-Ceramic Packaging in the 1990s R.R. Tummala
  6. Solid State Technology no.Jan. Ceramic for Packaging Part 1,2 D.L. Wilcox
  7. Introduction to Ceramics (2nd ed.) W.D. Kinger;H.K. Bowen;D.R. Uhlmann
  8. Am. Ceram. Soc. Bull. v.71 no.6 Design of High-Toughness Laminar Zirconia Composites D.B. Marshall
  9. Ceram. Eng. Sci. Proc. v.13 no.7-8 Flexural Properties of Brittle Matrix Laminar Copmposites C.A. Folsom;F.W. Zok;F.F. Lange
  10. Ceram. Age v.83 no.6 Laminated Ceramics B. Schwartz;D.L. Wilcox
  11. Solid State Technology no.Jan. Low-Temperature Cofired Tape Dielectric Material System for Multilayer Interconnections J.I. Steinberg;S.J. Horowitz;R.J. Bacher
  12. Ceramic Substrates and Packages for Electronic Application;Advances in Ceramics v.26 Materials Compatibility and Cosintering Aspects of Shrinkage Control in Low-Tenperature Cofired Ceramic Packages H.T. Sawhill
  13. J. Am. Ceram. Soc. v.73 no.12 Microstructure of 96% Alumina Cermics;Characterization of the As-Sintered Materials A. Powell-Dogan;A.H. Heuer