대한기계학회논문집A (Transactions of the Korean Society of Mechanical Engineers A)
- 제20권11호
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- Pages.3538-3548
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- 1996
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- 1226-4873(pISSN)
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- 2288-5226(eISSN)
DOI QR Code
전자패키지용 EMC의 기계적 성질 및 패키지내의 열응력해석
A Study on the Mechanical Properties of EMC and Thermal Stress Anlaysis in Electronic Packagings
- Shin, Dong-Kil (Dept. of Mechanical Engineering, Korea Advanced Institute of Science and Technology) ;
- Lee, Jung-Ju (Dept. of Mechanical Engineering, Korea Advanced Institute of Science and Technology)
- 발행 : 1996.11.01
초록
In this study, as a part of basic study for developing the simulation program for the assemssment of reliability of electronic EMC packaging which covers from EMC mixing step to thermal analysis, comparison between a measured and predicted values of material properties of EMC and finitde element analysis of thermal stress are performed. For the experimental testing specimens of fifty, sixty hive and eighty percent filler(
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