Optimization of Current Distributions of Electroplating on Patterned Substrates with the Auxiliary Electrode

보조 전극을 이용한 패턴된 전극에서의 전류 밀도 분포의 최적화

Based on the potential-theory model for secondary current distribution, we could predict the thickness distributions of electroplating on patterned substrates with the different size of the auxiliary electrode. The substrates contain lithographic patterns at each sample geometry. Each sample geometry had different current distribution at the same condition except the size of the auxiliary electrodes. The size effect of the auxiliary electrode on thickness distribution of electrodeposition on patterned electrode was investigated in a series of experiments. Copper was galvanostatically deposited from an acid-sulfate solution in a reciprocating paddle cell. The thickness distributions of the workpiece scale measured by profilometry across the specimen were in good agreement with the current distribution predicted by boundary element method.