Journal of the Korean Institute of Telematics and Electronics A (전자공학회논문지A)
- Volume 32A Issue 9
- /
- Pages.98-105
- /
- 1995
- /
- 1016-135X(pISSN)
Wideband Characterization of Angled Double Bonding Wires for Microwave Devices
초고주파 소자를 위한 사잇각을 갖는 이중 본딩와이어의 광대역 특성 해석
Abstract
Recent microwave IC's reach to the extent of high operating frequencies at which bonding wires limit their performance as dominant parasitic components. Double bonding wires separated by an internal angle have been firstly characterized using the Method of Moments with the incorporation of the ohmic resistance calculated by the phenomenological loss equivalence method. For a 30
Keywords