Electrical & Electronic Materials (E2M - 전기 전자와 첨단 소재)
- Volume 8 Issue 2
- /
- Pages.171-175
- /
- 1995
- /
- 2982-6268(pISSN)
- /
- 2982-6306(eISSN)
Optimization of remote plasma enhanced chemical vapor deposition oxide deposition process using orthogonal array table and properties
직교배열표를 쓴 remote-PECVD 산화막형성의 공정최적화 및 특성
Abstract
Optimum condition of remote plasma enhanced chemical vapor deposition using orthogonal array method was chosen. Characteristics of oxide films deposited by RPECVD with SiH
Keywords