Abstract
A new architecture of field programmable gate array for high-speed datapath applications is presented. Its implementation is facilitated by a configurable interconnect technology based on a one-time, two-terminal programmable, very low-impedance anti-fuse and by a configurable logic module optimized for datapath applications. The configurable logic module can effectively implement diverse logic functions including sequential elements such as latches and flip-flops, and arithmetic functions such as one-bit full adder and two-bit comparator. A novel programming architecture is designed for supplying large current through the anti-fuse element, which drops the on-resistance of anti-fuse below $20{\Omega}$. The chip has been fabricated using a $0.8-{\mu}m$ n-well complementary metal oxide semiconductor technology with two layers of metalization.