Journal of the Korean Institute of Telematics and Electronics A (전자공학회논문지A)
- Volume 31A Issue 12
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- Pages.44-55
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- 1994
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- 1016-135X(pISSN)
A Study on the Fatigue Life Prediction of Solder Joints under Thermal Cyclic Loading
온도사이클을 받는 Solder Joint의 피로수명에 관한 연구
Abstract
This study is to apply the theory of fatigue fracture to solder joints under thermal cyclic loading and predict life of solder joint to failure. A 62Sn-36Pb-2Ag solder was used in this study. Tensile tests were preformed at temperatures of 15.dec. C, 50.dec. C and 85.dec. C in order to find terms of crack length "a". plastic strain range ""
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