Abstract
This report details the microscopic aspects of grain boundary cracking in Pb-Sn eutecticduring displacement-controlled mechanical tests performed over a range of low frequency ($10^{-3}-10^{-5}$/s)and moderate strain range (0.2 - 1 %) where is the most technologically relevant to solder jointssubjected to thermal cycling. It is shown that intergranular cracking begins with the appearance ofcrack-like features (CLF's), which can be seen due in part because they are associated with grainboundary sliding, and is able to be described by certain stages of isolated crack growth. In the initialstages CLF's are not ture cracks but instead what I shall call "proto-cracks" where grain boundarysliding begins to damage the gram boundary at the surface. At some point during the initiation stagesonce proto-cracks become ture cracks, they develop into isolated cracks and the growth of isolatedcracks is eventually accomplished by coalescence, resulting in 5 stages of cracking.ing in 5 stages of cracking.
Pb-Sn eutectic bulk specimens을 thermal cycling동안 electronic package의 땜납이 격게되는 변형 조건 즉 $10^{-3}-10^{-5}$/s정도의 낮은 frequency와 0.2-1%정도의 적당한 strain range에서 피로파괴 실험을 했을때, grain boundary sliding과 관련하여 임계면을 따라 일어나는 균열이 5단계에 의해 묘사될 수 있다는 것을 보였음.