한국표면공학회지 (Journal of the Korean institute of surface engineering)
- 제26권6호
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- Pages.327-333
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- 1993
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
Cu-18wt% Cr 합금박막과 폴리이미드사이의 접착력 : 열처리 영향
Adhesion between Cu-18wt% Cr Alloy Film and Polyimide : Effect of Heat Treatment
초록
The effect of heat treatment on the adhesion between Cu-18wt% Cr film and polyimide has been studied by using T-peel test, AES, and XRD. Cu-18wt% Cr alloy and pure Cu films were sputter deposited onto pol-yimide. Cu was electroplated before and after heat treatment at
키워드