Journal of the Korean institute of surface engineering (한국표면공학회지)
- Volume 26 Issue 5
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- Pages.263-270
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- 1993
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
Effects of Surfactants on Electroless Copper Planting Bath for PCB
PCB제조용 무전해 동도금액에 대한 계면활성제의 영향
Abstract
The effects of surfactants on electorless copper plating bath for PCB was studied. Basic bath composition was cuplic sulfate 10g/l, EDTA.2Na 40 g/l, formalin
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