한국정밀공학회지 (Journal of the Korean Society for Precision Engineering)
- 제10권3호
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- Pages.182-190
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- 1993
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- 1225-9071(pISSN)
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- 2287-8769(eISSN)
초음파 분량법에 의한 레진 내부 결합의 크기 측정에 관한 연구
Sizing of lnner Flaw in Resin by using Ultrasonic spectroscopy
- Han, E.K. (Dept. of Precision Mechanical Engineering, Hanyang University) ;
- Kim, Y.J. ;
- Park, I.G.
- 발행 : 1993.09.01
초록
In manufacturing process of semiconductor package, the thermal stress owing to high temperature in moulding and the bubbles generated in chip bonding process become main causes to produce void. On this study we evaluated quantitatively void size by use of ultrasonic spectroscopy method which analyze the reflective pulses with broad band frequency in frequency domain, and after destructive testing we verified effectiv- eness of sizing void by use of ultasonic spectroscopy.