Journal of the Korean institute of surface engineering (한국표면공학회지)
- Volume 25 Issue 4
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- Pages.173-180
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- 1992
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
Effects of Stabilizing Additives on Electroless Copper Deposition
무전해 동 도금용액 속에서 안정제의 역할
Abstract
The effects of the stabilizing additives such as NaCN, 2-MBT and Thiourea on bath decom-position, plating rate and surface morphology have been studied. Bath stability was increased in the order of an additive-free bath, and NaCN-, 2-MBT-, and Thiourea-stabilized baths. The sta-bilizing effects may be attributed to the stability of Cu(II) -complexes. The plating rate is the re-verse order of the bath stability. Accelerative effect of 2-MBT in proper quantity(0.3mg/
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