Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Microsturctures of copper thin films sputtered onto polyimide

폴리이미드 위에 스퍼터 증착된 구리 박막의 미세구조

  • Chung, Tae-Gyeong (Dept. of electronic materials science and engineering, KAIST) ;
  • Kim, Young-Ho (Dept. of materials engineering, Hanyang university) ;
  • Yu, Jin (Dept. of electronic materials science and engineering, KAIST)
  • 정태경 (한국과학기술원 전자재료공학과) ;
  • 김영호 (한양대학교 재료공학과) ;
  • 유진 (한국과학기술원 전자재료공학과)
  • Published : 1992.04.01
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Abstract

Thed effects of sputter gas pressure and substrate surface micro-roughness on the microstructure and surface topography have been investigated in the Cu thin films sputter deposited onto polyimide substrates. The surface roughness of polyimide was controlled by oxygen rf plasma treatment. In the Cu film deposited at the pressure of 5 mtorr, the surface is smooth and the columnar structure is not visible regardless of polyimide surface more open boundaries. The polyimide surface roughness enhances these effects, These phenomena can be explained in therm of atomic shadowing effect.

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