마이카 강화 실리콘 복합재료의 제작과 그 유전적 특성에 관한 연구

A Study on the Dielectric Properties of Mica-reinforced Silicone Composites

  • 조정수 (부산대 공대 전기공학과) ;
  • 곽영순 (부산대 공대 전기공학과) ;
  • 김순태 (부산대 대학원 전기공학과) ;
  • 박차수 (부산대 대학원 전기공학과) ;
  • 박정후 (부산대 공대 전기공학과)
  • 발행 : 1992.06.01

초록

This paper describes the electric properties of mica reinforced silicone composites with the parameter of curing condition of silicone resin, application amount of silane coupling agent to the mica paper and the mica wt% to the composite. Heat-resistant silicone resin and mica paper made of mica flakes are used to prepared the mica/silicone composite as matrix and filler, respectively. To improve the dielectric properties and interfacial adhesion between matrix and filler, silane coupling agent is applied on the mica paper. As for matrix, tan$\delta$ value of 30$0^{\circ}C$ heat-treated silicone resin is the lowest under 1%. The optimal wt% of coupling agent is 0.3% to the weight of mica paper. 80 wt% of mica as filler to the mica/silicone composite shows the best electric properties. And the mica reinforced silicone composite shows good high-frequency and mechanical tensile stress properties.

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