Abstract
The crystallized solder glasses with the low melting temperature for electronic package were prepared with the compositions of 77-80wt% PbO, 4.5-6wt% ZnO, 7.5-8.5wt% $B_2O_3$, 1-2wt% CaO, and 0.5-2.0wt% $P_2O_5$ containing 3-7wt% $TiO_2$. The Characterization of the solder glasses were studied using DTA, SEM and XRD. Frit containing 3wt% $TiO_2$ had crytallzation temperature range of $420-440^{\circ}C$. The major crystalline phase was identified as $2PbO{\cdot}ZnO{\cdot}B_2O_3$ by X-ray diffraction. Frits containing 4 wt% $TiO_2$ consisted of crysalline Phases of $PbTiO_3$ and $2PbO{\cdot}ZnO{\cdot}B_2O_3$ in the temperature range of $420-440^{\circ}C$, When g1ass frit containing 5wt% $TiO_2$ were heat-treated in the temperature range of $440-460^{\circ}C$, major crytalline phase was perovskite lead titanate.
PbO 77-80wt%, ZnO 4.5-6wt%, $B_2O_3$ 7.5-8.5wt%, $TiO_2$ 3-7wt%, $P_2O_5$ 0.5-2wt%의 조성을 갖는 IC Package봉착용 저융점($400-460^{\circ}C$) 결정화유리 frit를 제조하였다. DTA-TMA, X-선 회절분석, SEM 등을 이용하여 봉착용 유리의 결정화 특성을 연구하였다. $TiO_2$ 함량이 3wt% 함유시료는 $420-440^{\circ}C$에서 $2PbO{\cdot}ZnO{\cdot}B_2O_3$의 결정이 균일성장하였다. $TiO_2$ 함량이 4wt% 첨가된 시료는 $420-440^{\circ}C$에서 $2PbO{\cdot}ZnO{\cdot}B_2O_3와\;PbTiO_3$ 결정이 섞여서 혼합결정을 이루고 있었다. 또한 $TiO_2$ 5wt% 첨가된 시료는 $440-460^{\circ}C$에서 perovskite $PbTiO_3$ 결정만 석출되었다.
